As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures.

A research team has fabricated a functional computer chip using molybdenum disulfide (MoS2), a ...

Use left and right arrow keys to seek audio. For roughly six decades, the semiconductor industry has followed a simple and reliable formula: make transistors smaller, pack more of them onto a chip, ...

The feature size of silicon-based transistors is approaching the theoretical limit, which puts forward higher requirements for the “atomic level manufacturing” of semiconductors. The basic idea of ...

Many modern electronic devices we use daily owe their existence to the process of semiconductor doping. Doped semiconductors are the result of careful modifications ...

An international research group has developed a novel technique enabling the creation of contacts at low temperatures. The novel contact types are reportedly able to enhance cell efficiency by up to 3 ...

The new method involves dipping the conductive plastic into a special salt solution – a photocatalyst – and then illuminating it with light for a short time resulting in a p-doped conductive plastic ...

The University of Konstanz and Chinese panel maker Longi have assessed the impact of gettering on LeTID in industrial Czochralski grown gallium-doped p-type silicon ingots and have found that defect ...