Technologists have created a new 3D integration process enabling flexible electronic systems with a thickness of less than 60 micrometer. This ultra-thin chip package (UTCP) technology allows ...
Belgian research organisation IMEC has revealed a 3D integration process that produces flexible circuits under 60µm thick. “This ultra-thin chip package [UTCP] technology allows integrating complete ...
(Nanowerk News) At today’s Smart Systems Integration Conference in Brussels (Belgium), technologists from IMEC and its associated laboratory at Ghent University present a new 3D integration process ...
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