According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion in 2026 to USD 11.11 billion by 2034, ...
BE Semiconductor Industries is a key player in die-attach and packaging equipment, critical for advanced chip manufacturing. BESIY benefits from AI-driven chip demand and leads in advanced die attach ...
Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging technologies is ...
SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
Rapidus has successfully begun installing ASML's Twinscan NXE:3800E EUV lithography system at its Innovative Integration for Manufacturing (IIM-1) facility in Chitose, Hokkaido, marking a significant ...
San Jose, Calif. — Tessera Inc. will officially roll out its MicroPILR packaging technology Monday (April16), claiming the interconnect could ultimately serve a broad array of chip and board ...
FREMONT, Calif., Nov. 15, 2022 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today announced that it has completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing ...
Samsung Electronics has made the thinnest cell phone, the Ultra Edition 6.9 and 9.9, with the help of Agere Systems' innovative chip designers. Samsung Electronics has made the thinnest cell phone, ...
2don MSNOpinion
China does not need Nvidia chips in the AI war — export controls only pushed it to build its own AI machine
But they are wrong. These arguments assume that China cannot succeed in AI without access to these advanced AI chips, which ...
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