Anthropic’s IPO filing sheds new light on the AI developer’s growing reliance on a small group of technology partners.

The DRAM spot market remained relatively quiet this week, partly due to holidays in several regional markets, while buyers ...

As AI chips grow larger and more complex, glass substrates are emerging as a potential next step in advanced packaging.

According to corporate database Qichacha, Wuhan Xinrongguang Technology Co., Ltd. (hereinafter "Wuhan Xinrongguang") was ...

TSMC is reportedly considering a major U.S. expansion beyond Arizona. According to Economic Daily News, sources say the chipmaker is planning a ...

Micro LED optical interconnect technology emerged as a focal point during CIOE (China International Optoelectronic Exposition) 2026. A wide range ...

As the AI boom fuels capacity expansion across logic and memory, silicon wafers are emerging as another key beneficiary, with ...

On September 22, Chengtong Fund announced that its managed China State-owned Enterprise Restructuring Fund (a sub-fund under ...

Alibaba is accelerating its push into AI infrastructure with new in-house chips. According to ijiwei, Alibaba’s T-Head has ...

As interest from external customers in Intel’s EMIB (Embedded Multi-die Interconnect Bridge) continues to grow, substrate ...

As TSMC prepares for A16 risk production in late 2026, its next-generation A14 node is reportedly running ahead of schedule.

China’s two major memory chipmakers are accelerating capacity expansion. According to Commercial Times, CXMT’s monthly DRAM ...