SPO 1-1 The individual will demonstrate an understanding of the various types of foam, foam equipment, and foam applications. EO 1-1 Identify the various types of foam, the characteristics of each, ...
Abstract: As highly integrated and miniaturized power components rapidly develop, the extreme heat accumulation of electronic devices easily occurs, leading to an urgent demand for better thermal ...
Abstract: 64Mp CIS with 0.5um pixels has been developed with three wafer layers (e.g. top-wafer for PDs and TG TRs, mid-wafer for pixel TRs, and bottom-wafer for the analog and logic circuits). The ...
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