A record-number of bowl games will be played across college football over the next three weeks and participating players will be decked out with free apparel, electronics, gift cards and other ...
Abstract: Through glass via (TGV) technology presents a promising alternative for 3-D vertical interconnects in advanced packaging. As device integration progresses, the number of through vias in ...
Abstract: The wet etching technique for glass micromachining is widely used in MEMS (Microelectromechanical System) to create complex structures and features at the micro-scale. One critical aspect of ...
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