Abstract: With the rapid development of the semiconductor filed, more and more advanced package types have turned up such as Quad Flat No-lead (QFN), Ball Grill Array (BGA), and so on to meet the ...
Just off interstate 94 in Minneapolis hides the small, but talent-filled Northern Clay Center. March 13 through April 26, “Sexual Politics: Gender, Sexuality and Queerness in Contemporary Ceramics” ...
Abstract: Molding process of packages is the key link in IC packages and test. Epoxy resin is melted to fill into a specific mold to coat the chip. Filling the cavity with dissatisfaction will lead to ...
We independently select these products—if you buy from one of our links, we may earn a commission. All prices were accurate at the time of publishing. When you move into a home, especially a ...
Architect, Chris Cornelius: We should be thinking about the physical things we put into the world and what relationships are we creating? Is it making the situation better or is it making it worse? I ...
3M Dynatel 2273 is an underground cable and fault locator that measures and pinpoints sheath, conductor, and insulation faults, and locates cable path and depth. It discriminates between low and high ...
AEMC 1045 1kV Insulation Resistance Meter provides insulation measurements up to 2GΩ with selectable 250V, 500V, and 1000V test voltages. Features include automatic test inhibition, automatic ...
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