Season 6 of DigiKey's Factory Tomorrow series highlights how manufacturers and suppliers are building the foundation for next ...
Renesas' 650V GaN device uses an 8x8mm dual-side-cooled package to increase power density in high-voltage data-center ...
GNSS advances, correction services and wireless technologies are enabling scalable, high-precision positioning for live ...
Taiwan and Singapore AI associations establish cooperation framework linking businesses, technical expertise, talent ...
Synopsys and TSMC expand AI-driven EDA, advanced packaging and silicon-proven IP for next-generation AI systems.
Microchip's latest devices support next-gen zonal architectures, delivering flexible, space-efficient connectivity that ...
Startup combines AI-based design and verification with internal tools to accelerate complex ASIC development from concept to ...
M31 and Ambiq combine low-leakage SRAM and standard-cell IP for power- and area-constrained AIoT and edge SoCs.
Growing AI chip sizes are pushing advanced packaging beyond reticle limits, increasing adoption of CoWoS-L and competing EMIB ...
PATEO and Arm will explore automotive physical AI applications spanning perception, interaction, computing and intelligent ...
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