Season 6 of DigiKey's Factory Tomorrow series highlights how manufacturers and suppliers are building the foundation for next ...

Renesas' 650V GaN device uses an 8x8mm dual-side-cooled package to increase power density in high-voltage data-center ...

GNSS advances, correction services and wireless technologies are enabling scalable, high-precision positioning for live ...

Microchip's latest devices support next-gen zonal architectures, delivering flexible, space-efficient connectivity that ...

Startup combines AI-based design and verification with internal tools to accelerate complex ASIC development from concept to ...

Taiwan and Singapore AI associations establish cooperation framework linking businesses, technical expertise, talent ...

M31 and Ambiq combine low-leakage SRAM and standard-cell IP for power- and area-constrained AIoT and edge SoCs.

PATEO and Arm will explore automotive physical AI applications spanning perception, interaction, computing and intelligent ...

Growing AI chip sizes are pushing advanced packaging beyond reticle limits, increasing adoption of CoWoS-L and competing EMIB ...

Synopsys and TSMC expand AI-driven EDA, advanced packaging and silicon-proven IP for next-generation AI systems.

Siemens and TSMC expand AI-enabled EDA workflows, packaging support and certification across leading process technologies.

Cadence and TSMC have expanded certified AI and HPC design flows across advanced nodes, chiplets and 3D-ICs.