Renesas' 650V GaN device uses an 8x8mm dual-side-cooled package to increase power density in high-voltage data-center ...

GNSS advances, correction services and wireless technologies are enabling scalable, high-precision positioning for live ...

Taiwan and Singapore AI associations establish cooperation framework linking businesses, technical expertise, talent ...

Synopsys and TSMC expand AI-driven EDA, advanced packaging and silicon-proven IP for next-generation AI systems.

Microchip's latest devices support next-gen zonal architectures, delivering flexible, space-efficient connectivity that ...

Startup combines AI-based design and verification with internal tools to accelerate complex ASIC development from concept to ...

M31 and Ambiq combine low-leakage SRAM and standard-cell IP for power- and area-constrained AIoT and edge SoCs.

Growing AI chip sizes are pushing advanced packaging beyond reticle limits, increasing adoption of CoWoS-L and competing EMIB ...

PATEO and Arm will explore automotive physical AI applications spanning perception, interaction, computing and intelligent ...

Siemens and TSMC expand AI-enabled EDA workflows, packaging support and certification across leading process technologies.